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Bisphenol F Epoxy Resin NPEF-170 E0454 Low viscosity Easy to process and mix Suitable for spraying

NPEF-170 is a low-viscosity, high-reactivity bisphenol F epoxy resin featuring outstanding chemical resistance, mechanical strength, and curing performance. Compared to traditional bisphenol A epoxy resins, NPEF-170 exhibits lower viscosity and higher crosslink density, making it suitable for high-performance coatings, composites, adhesives, and electronic encapsulation applications.

    Project

    Unit

    Typical Value

    Test Method

    Appearance

    -

    Colorless to pale yellow transparent liquid

    Visual Inspection

    Epoxy Equivalent Weight (EEW)

    g/eq

    160-175

    GB/T 4612

    Viscosity (25°C)

    mPa·s

    3,000-5,000

    GB/T 12007.4

    Density (25°C)

    g/cm³

    1.15-1.18

    GB/T 4472

    Volatile Content (105°C, 3h)

    %

    ≤0.5

    GB/T 1725

    Hydrolyzable Chlorine Content

    ppm

    ≤200

    GB/T 4618

    Softening Point

    °C

    <10(liquid)

    GB/T 4507


  • Parameters

    Project

    Unit

    Typical Value

    Test Method

    Appearance

    -

    Colorless to pale yellow transparent liquid

    Visual Inspection

    Epoxy Equivalent Weight (EEW)

    g/eq

    160-175

    GB/T 4612

    Viscosity (25°C)

    mPa·s

    3,000-5,000

    GB/T 12007.4

    Density (25°C)

    g/cm³

    1.15-1.18

    GB/T 4472

    Volatile Content (105°C, 3h)

    %

    ≤0.5

    GB/T 1725

    Hydrolyzable Chlorine Content

    ppm

    ≤200

    GB/T 4618

    Softening Point

    °C

    <10(liquid)

    GB/T 4507


I. Product Overview:

NPEF-170 is a low-viscosity, high-reactivity bisphenol F epoxy resin featuring outstanding chemical resistance, mechanical strength, and curing performance. Compared to traditional bisphenol A epoxy resins, NPEF-170 exhibits lower viscosity and higher crosslink density, making it suitable for high-performance coatings, composites, adhesives, and electronic encapsulation applications.

Specification  

Project

Unit

Typical Value

Test Method

Appearance

-

Colorless to pale yellow transparent liquid

Visual Inspection

Epoxy Equivalent Weight (EEW)

g/eq

160-175

GB/T 4612

Viscosity (25°C)

mPa·s

3,000-5,000

GB/T 12007.4

Density (25°C)

g/cm³

1.15-1.18

GB/T 4472

Volatile Content (105°C, 3h)

%

≤0.5

GB/T 1725

Hydrolyzable Chlorine Content

ppm

≤200

GB/T 4618

Softening Point

°C

<10(liquid)

GB/T 4507

Product Features:

Low Viscosity: Easy to process and mix, suitable for spraying, dipping, casting, and other techniques.

High Reactivity: Compatible with various curing agents (e.g., amines, acid anhydrides), enabling rapid curing.

Excellent Chemical Resistance: Resists acids, alkalis, solvents, and humid environments.

High Mechanical Strength: Achieves high hardness after curing with superior impact resistance and adhesion.

Low Chlorine Content: Suitable for high-purity applications like electronic encapsulation.

Environmentally Friendly: Complies with RoHS, REACH, and other environmental regulations.

 

IV. Product Applications:

Coatings: High-performance anti-corrosion coatings, floor coatings, marine coatings, etc.

Adhesives: Structural adhesives, electronic encapsulation compounds, composite bonding, etc.

Composites: Carbon fiber/glass fiber reinforced materials, wind turbine blade resin matrices, etc.

Electronic Packaging: Semiconductor packaging, potting compounds, insulating materials, etc.

Other: 3D printing photopolymer resins, mold manufacturing, etc.

 

V. Curing Recommendations:

NPEF-170 is compatible with various curing agents. Recommended curing systems:

Amines (e.g., TETA, DETA): Room-temperature or medium-temperature curing, suitable for adhesives and coatings.

Anhydride curing agents (e.g., MHHPA, MeTHPA): High-temperature curing (120-150°C), suitable for electronic packaging and high-performance composites.

Modified amines/polyether amines: Enhance toughness and impact resistance.

Latent curing agents (e.g., dicyandiamide): Suitable for single-component storage systems.

 

Typical Curing Conditions (using amine curing agents as an example):

Mixing Ratio: Resin : Curing Agent = 100 : 20–30 (by weight; refer to specific curing agent data)

Curing temperature: 25°C (24h) or 80°C (2-4h)

Post-curing (optional): 100-120°C (1-2h) to enhance performance

 

VI. Product Packaging:

225KG/drum. Store sealed in a cool, dry place away from direct sunlight. Recommended storage temperature: 10-30°C.

 

REMARK

The above information is believed to be accurate and presents the best explanation currently available to us. We assume no liability resulting from above content. The technical standards are formulated and revised by customers’ requirement and us, if there are any changes, the latest specification will be executed and confirmed in the contract.

 


Bisphenol F Epoxy Resin NPEF-170 E0454 Low viscosity Easy to process and mix Suitable for spraying
NPEF-170 is a low-viscosity, high-reactivity bisphenol F epoxy resin featuring outstanding chemical resistance, mechanical strength, and curing performance. Compared to traditional bisphenol A epoxy resins, NPEF-170 exhibits lower viscosity and higher crosslink density, making it suitable for high-performance coatings, composites, adhesives, and electronic encapsulation applications.
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Bisphenol F Epoxy Resin NPEF-170 E0454 Low viscosity Easy to process and mix Suitable for spraying

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